Scheme for improving the creep resistance of bismuth-based low-temperature solder

Effective solutions to improve the creep resistance of bismuth-based low-temperature solders include: 1) Nanoparticle doping (e.g., 3% Al₂O₃ doping reduces the steady-state creep rate to 2.4×10⁻⁸ s⁻¹); 2) Multi-element alloying (Bi-20Sn-0.5Ag can increase the stress exponent n from 4.2 to…


