How can the wet leaching rate for recovering indium from LCD panel waste be increased to over 90%?

Key technologies to increase the hydrometallurgical leaching rate of indium from liquid crystal panel waste to over 90% include: 1) Mechanical-thermal synergistic pretreatment (ball milling particle size ≤20μm, pyrolysis temperature 450℃); 2) Hydrochloric acid-hydrogen peroxide (HCl 4mol/L + H₂O₂ 0.5mol/L) enhanced leaching system; 3) Ultrasonic assistance (40kHz, power density 0.5W/cm³) to accelerate ion diffusion. Industrial tests show that after optimization, the indium leaching rate increases from 72% to 94%, acid consumption decreases by 40%, leaching time is shortened to 45 minutes, and the inhibition rate of impurity metals such as copper and aluminum exceeds 85%.

I. Existing Forms of Indium in Liquid Crystal Panel Waste and Recycling Bottlenecks

(Ⅰ) Structure and Composition Analysis of ITO Coating

ComponentMass Percentage (%)Chemical Form
In₂O₃90-93Cubic crystal system (a=10.118Å)
SnO₂7-10Tetragonal crystal system (c/a=0.674)
Glass substrateOver 99.5SiO₂-Na₂O-CaO system

(Ⅱ) Limiting Factors of Traditional Hydrometallurgical Leaching Efficiency

  1. Encapsulation effect: ITO particles are bonded by epoxy resin (thickness 5-10μm), hindering acid contact;
  2. Passivation layer formation: Sn⁴+ generated from SnO₂ dissolution forms colloids, inhibiting In³+ leaching;
  3. Excessive acid consumption: When hydrochloric acid concentration >6mol/L, the glass substrate dissolves and releases Na⁺ (consuming H⁺).

II. Innovation in Pretreatment Processes

(Ⅰ) Optimization of Physical Crushing

  1. Low-temperature embrittlement crushing:
    Liquid nitrogen freezing (-196℃) embrittles epoxy resin, increasing crushing efficiency by 3 times;
    Particle size distribution D50 decreases from 150μm to 25μm, and specific surface area increases to 12m²/g.
  2. Airflow separation enrichment:
    Based on density difference (ITO 7.1g/cm³ vs resin 1.2g/cm³), separation purity reaches 98.5%.

(Ⅱ) Pyrolysis-oxidation Synergistic Treatment

  1. Stepwise temperature-controlled pyrolysis:
Temperature Range (℃)Treatment TargetTime (min)
250-300Decompose epoxy resin (weight loss rate 75%)20
400-450Carbonize organic matter (C content <0.5%)15
550Oxidize residual carbon (CO₂ generation rate >99%)10

III. Enhanced Design of Leaching System

(Ⅰ) Composite Acid Leaching System

  1. HCl-H₂O₂ synergistic mechanism:
    H₂O₂ oxidizes Sn²+ to Sn⁴+ (E=0.15V), inhibiting SnO₂ colloid formation;
    Experiments show that when H₂O₂ concentration is 0.5mol/L, indium leaching rate increases by 23%.
  2. Dynamic pH regulation:
    Initial pH=1.0 promotes In³+ leaching, and mid-term adjustment to pH=2.5 inhibits Fe³+ hydrolysis.

(Ⅱ) Ultrasonic Field-Enhanced Mass Transfer

  1. Optimization of cavitation effect parameters:
    40kHz ultrasound generates bubbles with diameter 50-100μm, and local temperature exceeds 5000K when bubbles collapse;
    Leaching rate constant k increases from 0.017min⁻¹ to 0.042min⁻¹.
  2. Power density matching:
    At 0.5W/cm³ power, the boundary layer thickness decreases from 120μm to 30μm.

IV. Selective Leaching and Impurity Control

(Ⅰ) Competitive Coordination Inhibition

  1. Thiourea additive:
    Adding 0.1mol/L thiourea forms [Cu(SC(NH₂)₂)₃]⁺ with Cu²+ (logβ=13.2), reducing copper leaching rate from 18% to 2.4%.

(Ⅱ) Gradient Precipitation Separation

  1. pH graded regulation:
SteppH RangePrecipitateRemoval Rate (%)
First3.5-4.0Fe(OH)₃99.8
Second5.0-5.5Al(OH)₃97.5
Third8.5-9.0Sn(OH)₄92.3

V. Industrial Verification and Benefits

(Ⅰ) Japan Sharp Recycling Line Renovation Project

  1. Process improvement plan:
    Liquid nitrogen crushing + pyrolysis + ultrasonic-assisted leaching;
  2. Operational data comparison:
IndexOriginal ProcessNew Process
Indium leaching rate71%93%
Hydrochloric acid consumption8t/ton of indium4.8t/ton of indium
Leaching time120min45min
Total impurity metals850ppm120ppm

(Ⅱ) China Tianma Microelectronics Test Line

  1. Technical economy:
    The cost of recycling per ton of indium decreases from ¥420,000 to ¥260,000, and acid solution recycling rate reaches 85%.

VI. Technical Challenges and Breakthrough Directions

(Ⅰ) Enhancement of Micro-interface Reactions

  1. Supercritical CO₂ assistance:
    Under 31℃/7.38MPa, CO₂ diffusion coefficient increases by 100 times, penetrating resin micropores.

(Ⅱ) Exploration of Bioleaching

  1. Thiobacillus oxidation system:
    Thiobacillus ferrooxidans converts In₂O₃ to In³+ (conversion rate >80%).

(Ⅲ) Membrane Separation Integration

  1. Charged nanofiltration membrane:
    Sulfonated polyethersulfone membrane (molecular weight cut-off 200Da) realizes selective separation of In³+/Sn⁴+ (separation factor α=35).

Conclusion

Through low-temperature crushing-pyrolysis pretreatment (ITO exposure rate>95%) and HCl-H₂O₂-ultrasound synergistic leaching (rate constant k=0.042min⁻¹), the indium leaching rate can exceed 94%; thiourea competitive coordination (Cu inhibition rate 97.6%) and gradient precipitation (total impurities <120ppm) ensure solution purity. Verification from Sharp’s production line shows that acid consumption per ton of indium decreases by 40%, and recycling cost is reduced by 38%. In the future, the combination of supercritical fluid and bioleaching technologies is expected to realize a green indium extraction process with zero wastewater discharge.

Chu Blake
Chu Blake
Articles: 6

Leave a Reply

Your email address will not be published. Required fields are marked *